Technika jonowego rozpylenia

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Adrian Stachowiak
7 lat temu
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1 Technika jonowego rozpylenia dr K.Marszałek 1

2 Technika jonowego rozpylenia dr K.Marszałek 2

3 Mechanizm rozpylenia dr K.Marszałek 3

4 :Création et transferet des différentes espèces en pulvérisation cathodique magnétron. Powstawanie i transport cząstek w technice rozpylenia jonowego Dans la zone de lumière négative: IONISATION: DISSOCIATION: EXITATION: N 2 + e N e + e Ti + e Ti + + e + e Ar + e Ar + + e + e N 2 + e N + N + e puis N + e N + + e + e N 2 + e N* 2 + e dr K.Marszałek 4

5 Systemy rozpylenia diodowy diodowy z polem magnetycznym dr K.Marszałek 5

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7 Magnetrony słupowe gęstość mocy: 500 W/in 2 (80W/cm 2 ) P AX = 4x10-3 hpa odległość podłoża : 10 cm szybkość nanoszenia warstwy stali nierdzewnej : 140Å/s dr K.Marszałek 7

8 Magnetrony słupowe c.d. dr K.Marszałek 8

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10 Technical Data dr K.Marszałek 10

11 Rozpylenie reaktywne P P S x Re 3 1,5 10 v ( M Re 1/ 2 1/ 2 2 )[ s m ] 2 c A P x Re ciśnienie krytyczne reaktywnego gazu P c - ciśnienie całkowite - prawdopodobieństwo jonizacji (Ar); 0,02 A - powierzchnia tarczy v + - prędkość jonów (Ar) ; 500 m/s M, Re wydajność rozpylenia (1; 0,1 S - szybkość pompowania dr K.Marszałek 11

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Coating Processes DC Sputtering Using Standard Cathodes The material to be deposited onto glass substrates is fabricated into a plate (target) and attached to a cathode that is electrically isolated

Gas is admitted into the vacuum chamber, where it is ionized by the electric field, liberating positively charged ions and free electrons and generating an electric discharge.

13 Coating Processes DC Sputtering Using Standard Cathodes The material to be deposited onto glass substrates is fabricated into a plate (target) and attached to a cathode that is electrically isolated from an enclosing vacuum chamber and maintained at high negative potential. Gas is admitted into the vacuum chamber, where it is ionized by the electric field, liberating positively charged ions and free electrons and generating an electric discharge. Pure metals and alloys are sputtered in atmospheres of inert gases while depositing films of metal oxides and metal nitrides require atmospheres of Ar/O 2 or Ar/N 2, respectively. Standard DC Sputtering Positively charged ions (1)(+) are accelerated toward the negatively charged cathode(2) and impact the outer surface of its target(3) at high energies. These collisions eject atoms(4) from the target and cause emission of secondary electrons(e-)(5). Such ejected atoms condensate (6) on the glass substrate, forming a highly uniform film characterized by high reproducibility and high adhesion to the substrate. Secondary electrons collide(7a) with gas phase atoms, liberating more positively charged ions and free electrons (7b)(=self containing plasma). dr K.Marszałek 13

MF Sputtering Using TWINMAG - Cathodes Using standard DC sputtering systems for depositing films of SiO 2 in large scale intended to serve as diffusion barriers for LCD s or antireflective coatings

Introduction of LEYBOLD s Medium Frequency powered TWINMAG cathode solved this problem.

14 MF Sputtering Using TWINMAG - Cathodes Using standard DC sputtering systems for depositing films of SiO 2 in large scale intended to serve as diffusion barriers for LCD s or antireflective coatings on glass resulted in intolerable processing instabilities due to the insulating properties of these dielectric films. Introduction of LEYBOLD s Medium Frequency powered TWINMAG cathode solved this problem. Sputtering is now virtually entirely free of arcing, which translates into better film uniformities and higher deposition rates and yields. Arc Free Sputtering by Medium Frequency Our new TWINMAG cathode driven by medium frequency helps eliminate arcing problems when sputtering dielectrics. An alternating polarity twin magnetron configuration keeps anodes clean (= ever clean anodes ), even during lenghty coating runs. Positive charge that accumulates on cathodes during negative polarity half cycles is neutralized by free electrons during ensuing positive polarity half cycles. dr K.Marszałek 14

15 In Line and Multipass Coating Systems Types of Coating Systems The following principle types of coating systems are available: dr K.Marszałek 15

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17 Turnkey Coating Systems dr K.Marszałek 17

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21 Wsadowa linia technologiczna do jonowego rozpylania Widok ogólny urządzenia Komputerowy system sterowania procesem dr K.Marszałek 21

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